ColorChip Ltd. announces the innovative 800Gbps 2xFR4, DR8 transceiver modules, 800Gbp ACCs & AECs, and 1.6Tbp AEC cables that significantly increase data center and networking performance.
These solutions solve connectivity challenges from the first millimeter up to 10 km. With datacentres and carriers/MSOs rapidly migrating to 800Gbp and 1.6Tbp capability, a cost-effective, low-power, and reliable solution is an absolute requirement. ColorChip is leading the market with these innovative and cutting-edge capabilities.
In addition, significant cost and power reductions, along with advancing data center speeds and performance, are now available. Within data center planning, reducing the total cost per gigabit is a crucial requirement that ColorChip provides.
ColorChip will demo a full spectrum of 100G/Lane, including 400G in QSFP112, 800G in QSFP-DD800, OSFP 800G ACC, AEC, SR8, DR8, 2xFR4 series, and 1.6T OSFP-XD AEC at OFC. The solutions have various technology options to address the power consumption and performance industry demands. System-on-Glass, Silicon Photonics, Linear direct drive optics, and 5nm DSP-enabled low-power solutions will be showcased in various product lines jointly with our switch and key component supplier partners. Together we are enabling a new cutting-edge technology ecosystem. ColorChip will also bring the Glass interposer demo and AR glass demo to the showcase and participate in the OIF Interop demo.
“Customers’ feedback from Engineering drives colorChip’s technical innovations to Operations groups. We always look for opportunities to reduce costs per Gigabit to help customers build a more robust network through our connectivity solutions,” said Yigal Ezra, the CEO of ColorChip Group. “The 800Gbp and 1.6Tb technology is a great example where we address the challenges that arise as data throughput increases rapidly.”
About ColorChip
ColorChip is a technology innovator, designer and manufacturer in co-packaged optics, photonic integrated circuits based on its proprietary PLC waveguide technology, high-speed optical data center, and network interconnects up to 800Gb, 1.6Tb along with cost/power efficient active electrical cables. In addition, the company is delivering an array of advanced optical sub-systems spanning from the infrared regime, used in high-speed connectivity solutions for hyperscale data centers, access and core CSP networks, in addition to the visual regime used in the fields of AR/MR, Automotive and Medical industries.
Media contact: Einav Bahat einav@color-chip.com