800G QSFP-DD to 2×QSFP112 DAC & ACC

Overview

• ColorChip 800G QSFP-DD to 2×QSFP112 Cable Assembly enables high-speed breakout from a single 800G (8×100G PAM4) interface to two independent 400G (4×100G PAM4) QSFP112 ports.
  Available in both DAC (Direct Attach Copper) and ACC (Active Copper Cable) versions, this breakout solution provides flexible options for short-reach, high-density interconnects in AI clusters, cloud platforms, and next-generation data centers.
  

Key Features

• Supports 800G → 2×400G breakout operation
• Based on 8×100G PAM4 to 2×(4×100G PAM4) electrical lanes
• Available as DAC (passive) or ACC (active equalized) versions
• Compliant with QSFP-DD MSA, QSFP112 MSA, and IEEE 802.3ck
• Low insertion loss and excellent crosstalk performance
• Hot-pluggable QSFP-DD and QSFP112 form factors
• Compatible with all major AI/ML accelerators, switches, and NICs
• 26AWG and 30AWG cable
• Temperature Range: 0~ 70 °C
• 3.3V power supply

Applications

• 800G to 2×400G breakout in hyperscale data centers
• AI/ML cluster interconnects (GPU/Accelerator fabric)
• Short-reach interconnects requiring ultra-low latency (DAC)
• Cloud, HPC, and next-generation disaggregated network architectures